Aluminum Nitride Electrostatic Chuck

Edgetech Industries, Advanced Ceramics Division supplies high-quality Aluminum nitride (AlN) Ceramics Electrostatic Chuck at competitive price.

Aluminum Nitride Electrostatic Chucks (AlN ESC) for Precision Semiconductor Manufacturing

In advanced semiconductor production, wafers undergo numerous processing steps across multiple equipment stations. To ensure stable handling and positioning during these critical operations, the Aluminum Nitride Electrostatic Chuck (ESC) provides the ideal solution.

How Aluminum Nitride Electrostatic Chucks Work

Utilize high-voltage electrodes to generate a uniform electrostatic force
Securely clamp wafers without mechanical stress or warping
Maintain exceptional flatness for optimal processing accuracy
Ensure contamination-free operation for high-purity applications

Why Choose Aluminum Nitride (AlN) for ESCs?

Superior Thermal Conductivity – Efficient heat dissipation for temperature-sensitive processes
Excellent Electrical Insulation – Maintains performance under high-voltage conditions
High Purity & Stability – Ideal for demanding semiconductor environments

Custom AlN Electrostatic Chuck Solutions

At Edgetech Industries (Advanced Ceramics Division), we specialize in manufacturing:

High-performance AlN ceramic ESCs tailored to your specifications
Precision-engineered components for semiconductor, LED, and display production
Cost-effective solutions without compromising quality

Aluminum Nitride Ceramic Parameter

Item	Unit	AlN
Physical Property
Color	\	Grayish white, Beige
Volume Density	g/cm³	3.3
Surface roughness	um	0.2-0.85
Warpage	(length ‰)	≤3
Thermal properties
Thermal conductivity	W/m.k	170-230
Thermal expansivity	x 10^-6/°C (20℃-800℃)	4-6
Mechanical properties
Flexural strength	MPa	≥300
Electrical properties
Dielectric constant	1MHZ, 25℃	8-9
Dielectric strength	KV/mm	≥15
Volume resistivity	Ω.cm	≥10¹⁴

Typical characteristic

-Very high thermal conductivity

-High insulation capacity

-Low dielectric constant, effective against electronic signal interference

-Low thermal expansion

-Good metallization capacity

-Expansion coefficient can be matched with semiconductor silicon wafer

-Better mechanical strength than alumina

-Good corrosion resistance to molten metal

-Minimum impurity content, non-toxic, high purity

Application of AlN ceramic electrostatic chunk

Industry Applications

300mm wafer processing for advanced logic and memory devices
Compound semiconductor manufacturing (GaN, SiC)
Advanced packaging applications including fan-out wafer-level packaging
Micro-LED display production

Edgetech Industries delivers cutting-edge AlN electrostatic chuck solutions with:

Proprietary ceramic formulations for enhanced performance
Custom designs tailored to your equipment specifications
Rigorous quality control meeting SEMI standards

Packing

Our Aluminum Nitride Electrostatic Chuck is carefully handled to prevent damage during storage and transportation and to preserve the quality of our product in its original condition.