Silicon Carbide Trays, SiC Ceramic Tray

The Silicon Carbide Trays uses high-purity pressureless sintered silicon carbide ceramic as its raw material, which has the advantages of high hardness, wear resistance, high thermal conductivity, stable mechanical properties at high temperatures, corrosion resistance, etc. The product has high precision and good uniformity of wafer epitaxial layer etching.
The wafer carriers used in the epitaxial growth process are subjected to high temperature and chemical cleaning. Edgetech provides high-purity silicon carbide ceramic carriers that can withstand high temperatures, produce uniform heat distribution, consistent epitaxial layer thickness and resistance, and excellent chemical corrosion resistance.
Silicon Carbide Properties
| Item | Unit | SiC |
| Physical Property | ||
| Color | \ | Black |
| Density | g/cm3 | 3.1 |
| Mechanical properties | ||
| Bending strength(20℃) | Mpa | 400 |
| Compressive strength (20℃) | Mpa | 2200 |
| Elastic modulus (20℃) | Gpa | 400 |
| Fracture toughness (20℃) | MPam½ | 4 |
| Vickers hardness (HV1) | Gpa | 21 |
| Rockwell hardness(45N) | R45N | 88 |
| Thermal properties | ||
| Coefficient of thermal expansion (20℃-1000℃) | 10-6K-1 | 4 |
| Thermal conductivity | W/mk | 100-120 |
| Thermal shock stability | △T.℃ | 400 |
| Specific heat capacity | J/g·k | 0.67 |
| Maximum operating temperature(in air) | ℃ | 1600 |
| Electrical properties | ||
| Volume resistance (20℃) | Ωcm | 10^5 |
Applications Areas
It is mainly used in the ICP etching process of epitaxial layer thin film materials (GaN, SiO2, etc.) of LED wafer chips, precision ceramic parts for semiconductor diffusion, and the MOCVD epitaxial process of semiconductor wafers.
Packing
Our Silicon Carbide Trays are carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
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