Alumina Substrate

Edgetech Industries, Advanced Ceramics Division supplies high-quality Alumina Ceramic Substrate at competitive pricing

SKU: O13-S2
General Details

Alumina Substrate, Al2O3 Ceramic Substrate

Al2O3 Susbtrate 1

The purity of alumina substrates used in the electronics industry is about 96%. Alumina substrates have the advantages of abundant raw material sources, relatively low prices, good wear resistance, excellent electrical insulation performance, good thermal shock resistance and chemical corrosion resistance, high dimensional accuracy, and good bonding with metals. It is a ceramic substrate material with good comprehensive performance.
Edgetech provides alumina ceramics according to demand, and the size can be customized.

Alumina Cermic Performance

ItemUnitAl2O3
Physical Property
Color\White
Densityg/cm33.7
Purity%96
Gas Permeability\0
Water Absorption0%
Mechanical Properties
Vickers HardnessGPa15.7
Flexural StrengthMPa300
Compressive Strength (HV0.5)MPa2000
Elastic modulusGPa275
Fracture ToughnessMPam1/23.5
Thermal Properties
The Max Working Temperature℃1600
Thermal Conductivity at room temperatureW/m·k25
Coefficient of Thermal Expansion10-6/℃6.5-7.2
Thermal Shock Resistance△T℃200
Electrical Properties
Dielectric StrengthKV/mm>12
Dielectric Constant9-10
Dielectric Loss Angle(1MHz)0.0002
Volume ResistivityΩ·cm>1014

*The above information is for comparison only. The exact characteristics will vary depending on the manufacturing method.

Typical properties of Alumina ceramics

Al2O3 Susbtrate

-Good insulation performance

-Excellent high-temperature resistance: Stable in a high-temperature environment, not easy to deform, ablate oxidize, etc

-High strength and hardness: Can withstand certain mechanical pressure and impact, not easy to break or wear

-Excellent chemical stability, can operate stably in a chemically corrosive environment

-Good processing performance: Can achieve complex geometric shapes and high-precision dimensional requirements

Alumina Ceramic  Substrate Applications

-Power Electronics

-Electronic packaging

-Hybrid microelectronics

-Multi-chip modules, etc.

Packing of AlN ceramic substrate

Alumina substrates use appropriate outer boxes and internal buffer materials; Some components are also vacuum-packed.

 

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