Aluminum Nitride Substrates

Edgetech Industries, Advanced Ceramics Division supplies high-quality and competitive price advanced Aluminum Nitride Substrates.

SKU: AlN-S

Custom AlN Ceramic Substrates for Thermal Management

Edgetech supplies aluminum nitride substrates for power electronics, semiconductor packaging, laser systems, RF and microwave equipment, and other applications requiring electrical insulation together with efficient heat transfer.

Custom aluminum nitride substrate

Aluminum nitride is often selected when alumina cannot provide sufficient thermal performance but electrical isolation is still required. The finished performance of an AlN substrate, however, depends on more than thermal conductivity. Material grade, thickness, flatness, surface finish, dimensional tolerance, edge quality, and assembly conditions all influence the thermal and mechanical behavior of the final component.

Edgetech Industries provides bare and custom-machined AlN ceramic substrates according to customer drawings. Material grade, dimensions, tolerances, surface condition, and inspection requirements should be defined before quotation.

Aluminum Nitride Substrate Typical Product Information
Property	Available Range or Requirement
Material	Aluminum Nitride Ceramic
Thermal conductivity	170W/mk, 200W/mk, 230W/mk
Standard thicknesses	0.38mm, 0.5mm, 0.635mm, 1mm, 1.2mm, 1.5mm
Custome thicknesses	0.25mm~2mm
Maximum length and width	300mm x 300mm
Length and width tolerance	+/-0.2mm
Thickness tolerance	+/-0.05mm
Warpage	3‰
Surface roughness	Ra 0.05-0.8um
Surface condition	As-fired, lapped, polished
Holes and slots	Available according to drawing
Edge condition	Square, chamfered, or radiused
Metallization	Drawings, Gerber files, etc., need to be provided for evaluation.
Inspection reports	COA, dimensional inspection report, etc. available

Why Choose Aluminum Nitride Substrates?

Aluminum nitride (AlN) is a superior ceramic material offering:
✔ Exceptional Thermal Conductivity – Efficient heat dissipation for high-power applications
✔ Excellent Electrical Insulation – Ensures reliable performance in high-voltage environments
✔ Low Dielectric Constant & Loss – Ideal for high-frequency and RF applications
✔ Silicon-Matched CTE – Reduces thermal stress in semiconductor packaging
✔ Non-Toxic & Environmentally Safe – Suitable for sensitive applications

AlN is commonly considered when the application must remove heat from an electronic device without creating an electrically conductive path.

The highest published conductivity is not always the best purchasing specification. The selected material grade must also meet dimensional, surface, mechanical, electrical, and cost requirements.

Properties of Aluminum Nitride Ceramic

Item	Unit	AlN
Physical Property
Color	\	Grayish white, Beige
Volume Density	g/cm³	3.3
Surface roughness	um	0.2-0.85
Warpage	(length ‰)	≤3
Thermal properties
Thermal conductivity	W/m.k	170-230
Thermal expansivity	x 10^-6/°C (20℃-800℃)	4-6
Mechanical properties
Flexural strength	MPa	≥300
Electrical properties
Dielectric constant	1MHZ, 25℃	8-9
Dielectric strength	KV/mm	≥15
Volume resistivity	Ω.cm	≥10¹⁴

Bare and Custom-Machined AlN Substrates

This product page primarily covers bare and custom-machined aluminum nitride ceramic substrates.

ETI Ceramics can evaluate substrates with:

Bare AlN ceramic substrate

Rectangular or square profiles
Circular profiles
Custom outlines
Through-holes
Slots
Notches
Edge chamfers
Corner radii
Lapped surfaces
Polished surfaces
Controlled thickness
Application-specific flatness

Availability depends on substrate thickness, overall dimensions, tolerance requirements, and order quantity.

Metallization, bonded copper structures, or completed circuit configurations should not be assumed to be included unless they are specifically confirmed in the quotation.

Thickness, Flatness, and Surface Finish

Thickness should be selected according to the thermal path, handling requirements, assembly method, and mechanical load.

A thinner substrate may reduce heat-travel distance, but it can also be more sensitive to handling and mounting stress. A thicker substrate may improve stiffness but increases the conduction distance through the ceramic.

Flatness and surface finish are also important when the substrate contacts:

Semiconductor die
Adhesive or solder layers
Heat spreaders
Baseplates
Cold plates
Precision fixtures
Printed or deposited circuit layers

The purchase drawing should define the required flatness, measurement area, surface roughness parameter, and inspection condition. Terms such as “very flat” or “smooth surface” should be replaced with measurable values.

Key Applications of Aluminum Nitride Ceramic Substrate

Our AlN substrates are widely used in:

Electronics & Semiconductor Packaging

High-density hybrid circuits
Microwave & RF power devices
Machined aluminum nitride ceramic plate
Semiconductor power modules
Thin-film circuit substrates
Chip carriers requiring high thermal conductivity

LED & Optoelectronics

High-power LED packaging
Laser diode heat sinks
Optoelectronic component substrates

Industrial & Defense Applications

Power resistor substrates
Dielectric layers in optical storage
Military-grade electronic systems

Reliable Packaging & Quality Assurance

At Edgetech Industries, we ensure every aluminum nitride substrate is meticulously handled and packaged to prevent damage during transit. Our strict quality control guarantees that you receive premium AlN ceramic materials in perfect condition.

Partner with a Leading Aluminum Nitride Ceramic Supplier

For high-performance aluminum nitride ceramic substrates that enhance thermal management and device reliability, trust Edgetech Industries. Contact us today to discuss your project requirements!

AlN substrate for power electronics

FAQ Content

What thermal conductivity is available for aluminum nitride substrates?

Thermal conductivity depends on the specific AlN grade and test condition. ETI Ceramics should list only verified values for the exact grades offered. The highest conductivity value should not be applied to every substrate.

Is aluminum nitride better than alumina?

Aluminum nitride generally provides better thermal conductivity, while alumina may offer a lower-cost solution for applications with moderate heat loads. The correct choice depends on thermal performance, electrical requirements, dimensions, mechanical conditions, and budget.

Can aluminum nitride substrates be supplied with custom holes and profiles?

Custom holes, slots, notches, and outside profiles can be evaluated according to substrate thickness, feature size, tolerance, and quantity.

Does ETI Ceramics supply metallized AlN substrates?

This page primarily covers bare and custom-machined aluminum nitride ceramic substrates. Metallized configurations must be confirmed separately according to technical, production, and export requirements.

Why are flatness and surface finish important?

Flatness and surface finish can affect die attachment, interface thickness, contact area, assembly stress, and overall thermal resistance. They should be specified according to the next manufacturing or assembly process.