AlN High-temperature Co-fired Ceramics (HTCC)

Edgetech Industries, Advanced Ceramics Division supplies high-quality Aluminum Nitride Ceramics at competitive price.

SKU: AlN-HTCC

Aluminum Nitride AlN High-temperature Co-fired Ceramics (HTCC)

High-temperature co-fired ceramics (HTCC) mainly use aluminum oxide or Aluminum nitride (AlN) green ceramic ribbons and high-melting-point metal slurries such as tungsten, molybdenum, molybdenum, and manganese as the main raw materials. They are printed by screen printing. The slurry is printed on the green porcelain tape to form a metal circuit, and through-hole filling is used to conduct the upper and lower layers, and then multi-layer lamination and high-temperature sintering are performed (the sintering temperature of aluminum nitride HTCC is above 1800°C, and the aluminum oxide HTCC The sintering temperature is above 1500℃), and finally undergoes electroplating, welding and other processes to form a monolithic structure of a three-dimensional wiring system, which has corrosion resistance, high-temperature resistance, long life, high efficiency and energy saving, uniform temperature, good thermal conductivity, and thermal compensation speed Advantages of waiting quickly.

Edgetech Industries, Advanced Ceramics Division supplies high-quality Aluminum Nitride AlN High-temperature Co-fired Ceramics (HTCC) at competitive prices.

 Aluminum Nitride Ceramic Parameter

ItemUnitValue
ColorGrayish white, Beige
Water absorption%0
Volume Densityg/cm3≥3.30
Surface roughnessum0.2-0.85
Warpage(length ‰)≤2.5‰
Thermal conductivityW/m.k≥170
Thermal expansivityx 10-6/°C (20℃-800℃)4-6
Flexural strengthMPa≥350
Modulus of elasticityGPa310-320
Dielectric constant1MHZ, 25℃8.9
Dielectric lossx 10-44.6
Dielectric strengthKV/mm≥15
Volume resistivityΩ.cm≥1014

Advantage

-High structural strength

-High thermal conductivity

-Good chemical stability

-High wiring density

Application of Aluminum Nitride Ceramics

High-temperature co-fired ceramics have been widely used in heating and packaging fields that require higher thermal stability, smaller high-temperature volatile gases, and higher sealing requirements.

-Ceramic packaging shells

-UVLED brackets

-VCSEL brackets

-Substrates for optical communication modules

-Heat dissipation bridges

-RF and Microwave Packaging

-Radar Module Packaging

-Power Module Packaging

-Semiconductor heater

Packing

Our HTCC is carefully handled to prevent damage during storage and transportation and to preserve the quality of our product in its original condition.

Related Products